Roadmap
CUIL vs Cold Plate
A breakthrough in liquid cooling.
Cuil’s patented vapor chamber liquid cooling solution, enables the cooling modules of the HPC to be simple and powerful.
3D Phase-Change Heat Spreading for Hotspot Mitigation
CUIL’s liquid-cooled 3D vapor chamber uses evaporation and condensation to rapidly spread heat from localized hotspots across a larger condenser surface, where it is removed by the coolant. This three-dimensional heat-spreading mechanism reduces local peak temperatures and temperature gradients, improving thermal uniformity across multiple heat sources.
Fewer Thermal Interfaces, Lower Thermal Resistance
CUIL integrates the vapor chamber and cold plate into a one-piece module that can couple directly to the chip through a single thermal interface material (TIM) layer. By reducing interfaces along the heat-transfer path, this architecture lowers cumulative thermal resistance and improves chip-to-coolant heat transfer.
