About Cuil
Founded in 2010, Cuil initially focused on audio product design, demonstrating proficiency in sound and electronics-related technologies. After investing in machinery and materials research and development for more than ten years, the company extended its reach to the field of heat dissipation. X-forged technology provides efficient heat dissipation. Cuil combines audio technology knowledge with innovative X-Forging to demonstrate versatility. By diversifying into cooling technologies, it has demonstrated adaptability and a willingness to explore cutting-edge solutions beyond its initial focus on audio products.
Product Information
AI applications drive the development of related semiconductor technologies, doubling the computing power of GPUs, and the heat dissipation technology caused by the decline of computing elements has become the key.
The integrated vapor chamber provides customized services with specified specifications for customers with thick and thin requirements, providing efficient heat dissipation in a limited space. This design uses VC passive heat dissipation, which will not cause noise pollution.
The integrated heat dissipation module can be made into a complete long column according to the size of the customer’s needs, and is combined with a complete VC cavity below to continuously provide heat dissipation, and is suitable for products such as high current and high voltage.
The liquid cooling vapor chamber heat dissipation module combines an integrated heat dissipation module structure with a water cooling system. The upper active heat dissipation pump and the lower VC passive heat dissipation quickly dissipate the top heating element.
